Prof. Dr. Helmut Hummel

Microtechnologies, Micromachining, Microsystems, DNA chip arrays, Microsensors, Microactuators, Metrology, Physics and so on ...



I´m focused on the microtechnologies of microsystems, mainly on bulk micromachining. Especially the creation of DNA- and Polypeptide chiparrays with the aid of silicon and glass microtechnologies is one of my preferred working. With our equipment on Fachhochschule Regensburg I can give service and advice for various process and device technologies of semiconductor processing:

  • doubleside photolithographie
  • wafer probing
  • maskgeneration for micromachining masks
  • CV-tests
  • anodic bonding
  • thickness measurement of thin layers            
  • wet anisotropic and isotropic etching
  • sheet resistance measurement
  • high aspect ratio 3D-microsystems
    in metal or polymers at low costs
  • mechanical microprofiling (2-dim.)
  • glass wafer processing
  • optical microprofiling (3-dim.)

Further on there are some possibilities of simulation:

  • anisotropic wet etching simulation
  • process simulation of oxidation, implantation
    and diffusion processes
  • device simulation of MOS and bipolar devices    
    (e.g. based on process simulation)
  • thermal simulation of heat conduction, radiation
    and convection of simple microsystems

Two metrological instruments WIT1000 for thickness probe and OPTIMAP for 3D-microprofiling are developed and now commercial provided by MISTER.